FPC柔性电路

概述:

       当今产品发展日趋轻、薄、短、小,有些产品PCB并不能很好地满足要求,柔性电路FPC的应用更加契合多数客户的设计要求。捷卡长期服务于知名企业,在FPC的设计、质量、成本的管控已积累一定经验。我们将FPC同面标结合衍生出薄膜开关产品,优化人机交互界面,简化安装,提升其空间利用率。

  相比硬质印刷电路PCB,柔性电路FPC以其体积和重量优势,在三维空间内任意移动和伸缩,大大增加了其在电子设备上的应用性和灵活性。并且FPC还具有良好的散热性和可焊性,易于组装,精密程度高,稳定性良好。而对于承载要求较高的电路应用,软硬结合的方案亦可完美解决两个方案各自的痛点。












 制程能力: 

项目

制程能力

1

层数

1-6

2

拼板尺寸

最大:500X55mm

3

钻孔孔径

最小孔径: 0.15mm(6mil)
最大孔径: 6.5mm(256mil)  

4

底铜厚度

最小:1/3 oz
最大:3 oz

5

绝缘层厚度

最小:0.0125mm(PI)(0.5mIL)
最大:0.05mm(PI)(2mil)

6

电镀金厚度

0.05um

7

化学沉镍金厚度

0.05um---0.1um

8

蚀刻线宽、线距

S/S:2mil(0.05mm)
D/S:2mil(0.05mm)

9

蚀刻公差

宽度:±10%

10

外形公差(边到边)

±0.05mm(:±2mil)

11

组装定位公差

±0. 2mm(8mil)

12

产品表面处理类型

1. 电镀镍金/沉镍金板
2.
有机保焊膜板


FPC种类:

1、  单面板-- 采用单面PI敷铜板材料于线路完成之后,再覆盖一层保护膜,形成一种只有单层导体的软性电路板。

2、  双面板--使用双面PI板敷铜板材料于双面电路完成后,两面分别加上一层保护膜,成为一种具有双层导体的电路板。

3、多层柔性版-- 多层柔性板是将三层或更多层的单面柔性电路板或双面柔性电路板层压在一起,通过钻孔、电镀形成金属化孔,在不同层间形成了导电的通路。

4、  软硬结合板-- 由刚性和柔性基板有选择地层压在一起组成。结构紧密,以金属化孔形成导电连接。

Printed Electronic

Printed Electronic

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Silver Flexible Circuit Solutions

In order to provide a more cost-effective solution for our customers, Ideal Jacobs is honored to launch our new high performing “Silver Flexible Circuit” solution which can replace traditional etched copper traces on polyimide with fine spaces, narrow silver traces and complex components on a polyester substrate.



Product Features :
Polyester (PET) substrate - It is a flexible mate- rial, which can replace rigid printed circuit boards (PCBs) and is more cost-effective than polyamide. 

The width and space of the circuit in total is only 0.5mm, which can also be improved during the design process. This type of circuit also has low resistance and high conductivity, which can be formed to create various effective low power signal circuits.

Proprietary soldering technique - We are using traditional SMT processes on polyester sub- strate to solder narrow pin pace (0.5mm)

Applications:
Consumer/Home Appliance/Industrial/Medical Devices 


UV-cure Encapsulant - To protect the solder joints we
use the UV- cured encapsulant. This enables them to withstand vibration and mechanical shock.
This solution offers robust connection for various applications.



Silver Printing - This type of printing can replace cooper etching which is more cost-effective.

Environmentally Friendly - This type of solution does not require a facility to deal with harsh chemicals or waste materials.


It can be implanted with LED components to enhance the backlighting for user-interface.



Silver Flexible Circuit withFine Line Printing
Silver flexible circuits are ideal for low-power and low signal applications where space is a premium. By choosing silver, the customers can design a product that bends and flexes. Further- more Ideal Jacobs possess the technology of Find Line Printing, with the trace as narrow as 0.127mm . This capability provide an alternative to traditional copper circuitry, which makes silver flexible circuit more cost effective and desirable.

 

Product features:

•  Light weight
Flexible
•  Thin
•  Cost effective
•  Environmentally friendly

                                  

           

Application Area:

• Consumer/Smart Home Appliances
• Data Logging/Smart Tags
• Medical Devices
• Automotive Devices

Basic information :
Operating voltage: ≤50VDC
Operating current: ≤100mA
Insulation resistance: ≥50MΩ
Substrate withstand voltage: 2k DVC
Bending test: Silver ink/R(2mm)20times
ESD test : IEC61000-4-2;Level 4 Air
gap+/-15KV&Contact +/-8KV
Operating temperature: -40℃~85℃
Normal thickness: 0.125mm
Minimum Pitch: 0.5mm
Integrated circuits: QFN, QFP, D-PAK(0.50MMPitch)