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FPC

Overview:

With the trend of lighter, thinner and smaller product development, FPC is becoming a well-developed alternative of the PCB in some product applications.


Ideal Jacobs is specialized in design support, quality and most importantly the cost control through years of support to elite customers. We further insert FPC into the membrane switches to help our customers enhance human-machine interfaces, to simply assembly with counterparts and to further improve the whole space of products especially for main PCB. 


Flexible Printed Circuit largely improves the user experience and helps customer with more possibilities in product design by its compact size and light weight. It stretches freely in a three-dimensional space. Rigid-Flex PCB, on the other hand, can be an excellent support body of electronic components while being flexible.


Types of FPC:











Graphic Overlay
    Publish time 2019-12-02 17:19    
Graphic Overlay

What is a Graphic Overlay?

A graphic overlay is the outermost layer of the front panel. It is the intuitive part of an electronic interface that connects the user to the machine, device, or equipment; and the part of the front panel switch which is visible to the user, graphically defining the locations of the keypads, and explaining the operation of the equipment. For these reasons, the panel graphic overlay plays a significant role in defining the user experience.

 A well-designed graphic overlay makes a powerful first impression of your company and your equipment. The design of the panel overlay will set your equipment apart from the competition by providing an unsurpassed user experience.

 

Not only must the panel graphic overlay explain the operation of the equipment, it must satisfy aesthetic requirements, and more importantly, environmental and physical end-use application requirements.

 

Ideal Jacobs (Xiamen) is a renowned leader in the design and production of high-quality graphic overlays. Our graphic design department, color matching laboratory and silkscreen production capacity in a clean room, together qualify Ideal Jacobs to manufacture “best in class” silkscreen work. Backing up our production team is a support staff including materials engineers, R&D, and an in-house environmental testing laboratory.

 

Some surface finish options:

Velvet ( various levels available)

Gloss finish ( various levels available)

Anti-reflective

Anti-microbial

Additional selective textures offered through our screen printing process such as: UV
cured selective textures

 

Windows:

Clear LCD or LED

ITO armored using optical clear lamination conducted in one of our clean rooms

Dead front

Interchangeable legends

Smoked as well as translucent colors for backlighting purposes

Embossing/forming:

Multi-level platform options

Finger guide, LED, braille, pillow either as a standalone or combination of
Cold and hot embossing

Hydroforming

ClickTouch thermoformed embossing

Printing:

Screen printing conducted in one of our clean rooms

Digital Printing

Cutting:

Laser traced steel rule dies

Tinplate high precision tools

Laser and CNC cutting

 

1)     Single Layer of FPC

It has a layer of chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is a rolled copper foil.


2)     Double-sided FPC

The double-sided FPC has a conductive pattern made by etching on both sides of the insulating base film, which increases the wiring density per unit area.


3)     Multilayer FPC

Multi-layer FPC is to laminate 3 or more layers of single-sided or double-sided flexible circuits together, and form metallized holes by drilling and electroplating to form conductive paths between different layers.


4)    Rigid-Flex  PCB

it includes two or more conductive layers that comprise either flexible or rigid insulation material between each one. Both rigid and flexible areas that make them ideally suited for a wide range of applications.


Basic Specification:


No.

Item

Producing Capability

1

Layers

1-6
Including Rigid and Flexible Circuit)

2

Panel Size

Max:500X550mm

3

Drilling Diameter

Min. Diameter: 0.15mm(6mil)
Max. Diameter: 6.5mm(256mil)  

4

Base Material Copper Thickness

Min:1/3 Oz
Max:3 Oz

5

Insulating Layer Thickness

Min:0.0125mm(PI)(0.5mIL)
Max:0.05mm(PI)(2mil)

6

Electroplating Au Thickness

≥0.05um

7

Chemical Immersion Ni/Au Thickness

0.05um---0.1um

8

Etching Line Width & Space

S/S:2mil(0.05mm)
D/S:2mil(0.05mm)

9

Etching Tolerance

Width:±10%

10

Outline Tolerance(from side to side)

±0.05mm(:±2mil)

11

Parts Fixed Position Tolerance

±0. 2mm(8mil)