FPC

Overview:

With the trend of lighter, thinner and smaller product development, FPC is becoming a well-developed alternative of the PCB in some product applications.


Ideal Jacobs is specialized in design support, quality and most importantly the cost control through years of support to elite customers. We further insert FPC into the membrane switches to help our customers enhance human-machine interfaces, to simply assembly with counterparts and to further improve the whole space of products especially for main PCB. 


Flexible Printed Circuit largely improves the user experience and helps customer with more possibilities in product design by its compact size and light weight. It stretches freely in a three-dimensional space. Rigid-Flex PCB, on the other hand, can be an excellent support body of electronic components while being flexible.


Types of FPC:











Printed Electronic
    Publish time 2019-12-03 09:30    
Printed Electronic


Silver Flexible Circuit Solutions

In order to provide a more cost-effective solution for our customers, Ideal Jacobs is honored to launch our new high performing “Silver Flexible Circuit” solution which can replace traditional etched copper traces on polyimide with fine spaces, narrow silver traces and complex components on a polyester substrate.



Product Features :
Polyester (PET) substrate - It is a flexible mate- rial, which can replace rigid printed circuit boards (PCBs) and is more cost-effective than polyamide. 

The width and space of the circuit in total is only 0.5mm, which can also be improved during the design process. This type of circuit also has low resistance and high conductivity, which can be formed to create various effective low power signal circuits.

Proprietary soldering technique - We are using traditional SMT processes on polyester sub- strate to solder narrow pin pace (0.5mm)

Applications:
Consumer/Home Appliance/Industrial/Medical Devices 


UV-cure Encapsulant - To protect the solder joints we
use the UV- cured encapsulant. This enables them to withstand vibration and mechanical shock.
This solution offers robust connection for various applications.



Silver Printing - This type of printing can replace cooper etching which is more cost-effective.

Environmentally Friendly - This type of solution does not require a facility to deal with harsh chemicals or waste materials.


It can be implanted with LED components to enhance the backlighting for user-interface.



Silver Flexible Circuit withFine Line Printing
Silver flexible circuits are ideal for low-power and low signal applications where space is a premium. By choosing silver, the customers can design a product that bends and flexes. Further- more Ideal Jacobs possess the technology of Find Line Printing, with the trace as narrow as 0.127mm . This capability provide an alternative to traditional copper circuitry, which makes silver flexible circuit more cost effective and desirable.

 

Product features:

•  Light weight
Flexible
•  Thin
•  Cost effective
•  Environmentally friendly

                                  

           

Application Area:

• Consumer/Smart Home Appliances
• Data Logging/Smart Tags
• Medical Devices
• Automotive Devices

Basic information :
Operating voltage: ≤50VDC
Operating current: ≤100mA
Insulation resistance: ≥50MΩ
Substrate withstand voltage: 2k DVC
Bending test: Silver ink/R(2mm)20times
ESD test : IEC61000-4-2;Level 4 Air
gap+/-15KV&Contact +/-8KV
Operating temperature: -40℃~85℃
Normal thickness: 0.125mm
Minimum Pitch: 0.5mm
Integrated circuits: QFN, QFP, D-PAK(0.50MMPitch)


1)     Single Layer of FPC

It has a layer of chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is a rolled copper foil.


2)     Double-sided FPC

The double-sided FPC has a conductive pattern made by etching on both sides of the insulating base film, which increases the wiring density per unit area.


3)     Multilayer FPC

Multi-layer FPC is to laminate 3 or more layers of single-sided or double-sided flexible circuits together, and form metallized holes by drilling and electroplating to form conductive paths between different layers.


4)    Rigid-Flex  PCB

it includes two or more conductive layers that comprise either flexible or rigid insulation material between each one. Both rigid and flexible areas that make them ideally suited for a wide range of applications.


Basic Specification:


No.

Item

Producing Capability

1

Layers

1-6
Including Rigid and Flexible Circuit)

2

Panel Size

Max:500X550mm

3

Drilling Diameter

Min. Diameter: 0.15mm(6mil)
Max. Diameter: 6.5mm(256mil)  

4

Base Material Copper Thickness

Min:1/3 Oz
Max:3 Oz

5

Insulating Layer Thickness

Min:0.0125mm(PI)(0.5mIL)
Max:0.05mm(PI)(2mil)

6

Electroplating Au Thickness

≥0.05um

7

Chemical Immersion Ni/Au Thickness

0.05um---0.1um

8

Etching Line Width & Space

S/S:2mil(0.05mm)
D/S:2mil(0.05mm)

9

Etching Tolerance

Width:±10%

10

Outline Tolerance(from side to side)

±0.05mm(:±2mil)

11

Parts Fixed Position Tolerance

±0. 2mm(8mil)